產品概述
MG2608是采用LCC封裝的超小尺寸貼片式模組,尺寸僅為15.8*17.7 mm。MG2608可以通過其管腳焊盤內嵌于客戶應用中,提供了模組與客戶主板間豐富的硬件接口。該模組是一款GSM+GPRS無線模塊,支持4頻(900/1800MHz + 850/1900MHz),可支持85.6Kbps上下行速率。
產品亮點
封裝
參數
* LCC Form Factor
* Dimensions: 15.8mm × 17.7mm× 2.3mm
* Weight: About 4.0g
* Band support:GSM850/900/1800/1900
* Transmit Power:
--冷啟動-148dBm 熱啟動-162dBm
* Power Supply :
--GSM850/900: 33dBm (Power Class 4)
--GSM1800/1900:30dBm(Power Class 1)
* Power Supply :
--3.3V ~ 4.6V(3.8V is recommended)
* GPRS
--Max Uplink 85.6Kbps / Downlink 85.6 Kbps
* UART
* SIM interface (1.8/3.0V)
* GPIO ADC
* RF PAD for Primary Antenna
* Reset & Power-on
* Embedded TCP /IP
* FTP
* HTTP connection
* AT Commands according to 3GPP GSM07.05, GSM07.07 and GOSUNCN extended AT commands
* Operation temperature: -30°C to +75°C
--Extreme Operating temperature: -40°C to +85°C
* Storage temperature: -40°C to +85°C
* Humidity: 5%~ 95%